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3D Printing Sprints for Hardware Prototyping

3D Printing Sprints for Hardware Prototyping

Why additive manufacturing belongs in your R&D toolkit

Enterprise product teams are adopting 3D printing farms so mechanical and electrical engineers can iterate together. Instead of waiting weeks for machined parts, a fused deposition modeling (FDM) prototype ships overnight, and resin printing unlocks sub-millimeter precision for connector housings.

Sprint cadence

We run print sprints aligned with firmware releases:

  1. Day 1 – CAD sync. Mechanical and electronics engineers co-design in Fusion 360 or SolidWorks. Defined interfaces include cable routing, ventilation, and antenna clearance.
  2. Day 2 – Prototype run. Jobs are queued on printers (Prusa, Formlabs, or Bambu Lab depending on material).
  3. Day 3 – Fit testing. Assemblies are validated against actual boards, fans, and harnesses. Issues are logged straight in Jira/ADO.

Material choices

  • PETG: balanced strength and heat resistance. Ideal for edge compute chassis deployed in factory floors.
  • Nylon with carbon fiber: high stiffness, great for fixtures that need torque resistance.
  • Flexible TPU: shock-absorbing gaskets or cable strain reliefs.

Exploded view of a 3D-printed enclosure

Integration with electronics

3D printing shines when combined with modular electronics:

  • Snap-fit standoffs accommodate different SBC form factors (Jetson, Raspberry Pi 5, Intel NUC).
  • Cable management channels ensure airflow around high-wattage components.
  • Embedded QR codes or NFC tags printed into the chassis simplify asset tracking.

Embed a timelapse of a print run or a lab tour.

Quality and compliance

Document flammability ratings (UL 94) and run accelerated life testing before moving prototypes to pilot deployments. For certifications, 3D prints often serve as pre-cert samples while the injection molds are cut.

Finish by linking to a downloadable checklist with BOM templates and print farm maintenance routines.